Privacy Statement
The Tech-Sphere Journal of Engineering Research and Innovation (TSJERI), a subsidiary of the Tech-Sphere Multidisciplinary International Journal (TSMIJ), is committed to protecting the privacy of our users, authors, reviewers, and editors.
This privacy statement outlines how we collect, use, and safeguard personal information provided through our website and journal management system.
Information Collection
We collect personal information such as names, email addresses, institutional affiliations, ORCID iDs, and contact details for the purposes of:
-
Manuscript submission and peer review
-
Editorial communication
-
Indexing and citation
-
Author recognition and academic visibility
We do not collect unnecessary personal data or share your information without your consent.
Use of Information
All personal information submitted to TSJERI is used solely for academic and publishing purposes. We do not sell, rent, or disclose user data to third parties, except where required by indexing agencies or publication standards (e.g., for DOI registration and ORCID linking).
Cookies and Tracking
Our website may use cookies to enhance user experience and collect anonymized traffic data for website optimization. Users may disable cookies in their browser settings without affecting access to content.
Third-Party Services
TSJERI may link to external services such as Google Scholar, Semantic Scholar, ORCID, and CrossRef. Please refer to their respective privacy policies for information on how they handle data.
Data Protection
All user data is stored securely and protected against unauthorized access. Access is limited to authorized editorial staff and technical administrators of the journal portal.
User Rights
Users have the right to request access to their personal data, request corrections, or request removal of their data from our system. To do so, please contact us at chief-editor@techspherejournals.com.
By using this site and submitting manuscripts, you agree to the terms of this privacy policy.
For questions or concerns, please contact: